MediaTek Dimensity 9500 SoC Tipped to Offer Improved Ray Tracing and AI Performance; Specifications Leak 1h3441 Technology News

The chipset's NPU 9.0 may offer up to 100 TOPS of AI performance. a3z1f

Written by Manas Mitul | Updated: 29 April 2025 14:06 IST

MediaTek Dimensity 9500 SoC Tipped to Offer Improved Ray Tracing and AI Performance; Specifications Leak

Photo Credit: MediaTek 396l2f

MediaTek Dimensity 9500 is the purported successor to the Dimensity 9400 SoC

Highlights

Dimensity 9500 SoC is tipped to be fabricated using TSMC's N3P process
The chipset may be equipped with Arm's latest Cortex-X9 series cores
It is speculated to be launched in October 2025

ment

AI) — the latter ed by a neural processing unit (NPU) capable of delivering 100 tera operations per second (TOPS) performance.

MediaTek Dimensity 9500 Chipset Specifications Leak 1f1ce

Tipster Digital Chat Station (translated from Chinese) leaked specifications of the purported MediaTek Dimensity 9500 chipset in a post on the Chinese microblogging platform Weibo. Fabricated using the N3P process, the SoC is tipped to come with an octa-core architecture, though its makeup could be different compared to what previous rumours suggested.

Instead of having a 2 + 6 configuration, the Dimensity 9500 chipset may have one Cortex-X930 prime cores dubbed “Travis”, three cores dubbed “Alto”, and four Cortex-A730 "Gelas" cores.

Google Will Host 'Android Show' Ahead of Annual I/O Conference in May

The SoC is said to be complemented by an Immortalis-Drage GPU which could offer improvements in of ray tracing and AI, while also reducing the power consumption, courtesy of a new GPU microarchitecture. Meanwhile, an NPU 9.0 is tipped to deliver 100 TOPS of AI performance. As per the tipster, the Dimensity 9500 chipset will have 16MB of L3 cache and 10MB of SLC cache. Touted to be a flagship offering, it may devices equipped with up to LPDDR5X RAM and up to UFS 4.1 storage.

Past reports suggest that the N3P process used by TSMC for the purported chipset's fabrication could result in a 5 percent performance gain and a 5-10 percent efficiency improvement as compared to the current Dimensity 9400 SoC which is built using the N3E process. It may also benefit from improved multi-thread performance with the use of Arm's Scalable Matrix Extension (SME) which can accelerate AI and ML-based applications and provide enhanced for matrix operations.

Although no official details are known regarding the launch timeline of the Dimensity 9500 SoC, its predecessor was announced in October 2024, and the purported chip could also launch around the same time this year.

Comments

For the latest reviews, follow Gadgets 360 on X, Facebook, WhatsApp, Threads and Google News. For the latest videos on gadgets and tech, subscribe to our YouTube channel. If you want to know everything about top influencers, follow our in-house Who'sThat360 on Instagram and YouTube.

Further reading: MediaTek

Shaurya Tomer

Email Shaurya Tomer

Shaurya Tomer is a Sub Editor at Gadgets 360 with 2 years of experience across a diverse spectrum of topics. With a particular focus on smartphones, gadgets and the ever-evolving landscape of artificial intelligence (AI), he often likes to explore the industry's intricacies and innovations – whether dissecting the latest smartphone release or exploring the ethical implications of AI advancements. In his free time, he often embarks on impromptu road trips to unwind, recharge, and ...More